The Next generation of the Qualcomm Chipset the Snapdragon 855 is rumored from a quite long time, however, the name of the processor this time is said to be Snapdragon 8150 as leaked from various sources.
The renowned tipster Roland Quandt today tweeted that the Qualcomm Snapdragon 8150 will also adopt a three-cluster CPU core cluster design similar to Huawei Kirin 980. That is to say, this chip has 2 large cores, two large cores and four Small core.
Kirin 980 is the world’s first commercial use of the Cortex-A76 architecture CPU and the Mali-G76 GPU. The CPU adopts 2 super large cores (based on Cortex-A76), 2 large cores (based on Cortex-A76), and 4 small core (Cortex-A55) 2+2+4 core designs. The single core performance is improved by 75% and the energy efficiency is also improved.
Qualcomm is doing what Huawei does with the Kirin 980: using three CPU core clusters on the SM8150 (SDM855) – 4 "Silver", 2 "Gold", 2 "Gold+" cores.
— Roland Quandt (@rquandt) October 28, 2018
Snapdragon 8150 will be manufactured using TSMC’s 7nm FinFET process. In addition, the chip will be added to the independent NPU, which will usher in a substantial increase in AI, rather than the current “AIE”.
According to Roland Quandt, the Snapdragon 8150 will be unveiled at the annual summit in Hawaii in December this year.